4.8 Article

Strain-Stiffening Ionogel with High-Temperature Tolerance via the Synergy of Ionic Clusters and Hydrogen Bonds

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 15, Issue 26, Pages 31888-31898

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.3c05802

Keywords

ionogel; ionic liquid; ionic cluster; hydrogen bond; strain stiffening; high-temperaturetolerance; strain sensor

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Highly stretchable and conductive ionogels have great potential in flexible electronics and soft robotic skins, but currently, they cannot accurately replicate the mechanical behavior of real human skin. This study introduces a physically cross-linked ionogel (PCI) by combining ionic clusters with hydrogen bonds. The PCI exhibits strain-stiffening behavior similar to human skin and remains stable even in high temperatures. It also has high transparency, recyclability, good adhesion, and high conductivity, making it suitable for skin-like sensing in harsh environments for future bionic machines.
Highly stretchable and conductive ionogels have greatpotentialin flexible electronics and soft robotic skins. However, current ionogelsare still far from being able to accurately duplicate the mechanicallyresponsive behavior of real human skin. Furthermore, durable roboticskins that are applicable under harsh conditions are still lacking.Herein, a strong noncovalent interaction, ionic clusters, is combinedwith hydrogen bonds to obtain a physically cross-linked ionogel (PCI).Benefiting from the strong ionic bonding of the ionic cluster, thePCI shows strain-stiffening behavior similar to that of human skin,thus enabling it to have a perception-strengthening ability. Additionally,the strong ionic clusters can also ensure the PCI remains stable athigh temperatures. Even when the temperature is raised to 200 & DEG;C,the PCI can maintain the gel state. Moreover, the PCI exhibits hightransparency, recyclability, good adhesion, and high conductivity.Such excellent features distinguish the PCI from ordinary ionogels,providing a new way to realize skin-like sensing in harsh environmentsfor future bionic machines.

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