4.8 Article

Studies on the Platinum Thick Film Sensor Conformally Written by Laser Micro-Cladding: Formability, Microstructure, and Performance

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 15, Issue 15, Pages 19209-19219

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.3c01974

Keywords

laser micro-cladding; Pt thick film sensor; laser power density; microstructure; electrical properties; high temperature-sensing performance

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In this study, laser micro-cladding technology was used to prepare high-temperature Pt thick film sensors. The research systematically investigated the formability, microstructure, sintering mechanism, and electrical properties of the Pt thick films. It was found that the sintering degree and properties of the Pt films were influenced by the laser power density. The study successfully developed Pt thick film temperature sensors with superior performance.
In this paper, laser micro-cladding technology (LMC) was conducted to prepare high-temperature Pt thick film sensors in situ. The formability, microstructure, sintering mechanism, and electrical properties of the LMCed Pt thick films were first studied systematically. Results indicated that with the increase of laser power density, the sintering degree of the Pt thick film increased obviously, improving its adhesion strength and reducing its resistivity. However, when the laser power density exceeded the threshold, holes or grooves were formed in the Pt film, leading to the degeneration of its properties. A Pt thick film with good adhesion strength, excellent conductive networks, and the minimum resistivity (46 +/- 2 mu omega center dot cm) was obtained at a laser power density of 1.37 x 106 W center dot cm-2. Then, Pt thick film temperature sensors (including Pt thermal resistance temperature (RTD) and Pt-Pt10%Rh thermocouple sensors) were conformally prepared by LMC. Their temperature-sensing performance became stable after the initial high-temperature calibration, with a linearity of 0.9985 for the RTD with a TCR of 2.46 x 10-3/degrees C (at 920 degrees C) and a linearity of 0.9905 for the thermocouple with a Seebeck coefficient of 9.7 mu V/degrees C, both of which are better than that made by direct DC magnetron sputtering deposition. Therefore, this work provides a novel feasible way to conformally integrate high-performance Pt film sensors in situ.

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