Construction of a Reciprocal-Supporting Phenol-amine@CuNW Network for Antisedimentation Conductive Ink

Homogeneously dispersed copper nanowire(CuNW) materialsare thebasis for practical applications in many types of electronic devices.At present, the dispersion of CuNWs in water is achieved through polymericspatial site resistance effects primarily and the electrostatic dispersionmechanism in a few. However, the electrical conductivity of CuNWscould be weakened by the excessive addition of polymers; therefore,it is difficult to maintain a stable dispersion enduringly for surfacecharge modifiers. Based on the coagulation mechanism of colloids,a novel antisedimentation mechanism is refined by this work. Directedby this mechanism, a stable reciprocal-supporting antisedimentationconductive CuNW ink was achieved enduringly and a uniform conductivecoating (1.81-5.65 omega center dot sq(-1)) wassuccessfully manufactured. The tannic acid-polyethylene imine(TA-PEI) could support copper nanowires to maintain a stable heightof 61.4% after 15 days best, while CuNWs in other systems would settlecompletely in one day. Meanwhile, the TA-PEI composite cluster antisedimentationnetwork not only provided massive spatial potential resistance forCuNWs but also modified the surface charge of CuNWs. CuNWs were dispersedstably in this phenol-amine@CuNW network. Furthermore, the CuNWs werecrosslinked more tightly with each other relying on the vigorous adhesiveproperties of TA-PEI. With this antisedimentation mechanism and simpletreatment process, CuNW ink will be utilized in more applications.

Automated summary

In this study, a novel antisedimentation mechanism was proposed based on the coagulation mechanism of colloids. A stable reciprocal-supporting antisedimentation conductive copper nanowire ink was prepared and a uniform conductive coating was successfully manufactured. This antisedimentation mechanism relied on the tannic acid-polyethylene imine composite cluster to provide spatial potential resistance and modify the surface charge of copper nanowires, resulting in stable dispersion in the network.