Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachining

Silicon bulk micromachining is extensively employed method in microelectromechanical systems (MEMS) for the formation of freestanding (e.g., cantilevers) and fixed (e.g., cavities) microstructures. Wet anisotropic etching is a popular technique to perform silicon micromachining as it is low-cost, scalable, and suitable for large scale batch processing, which are the major factors considered in the industry to reduce the cost of the product. In this work, we report the wet anisotropic etching characteristics of Si{111} in sodium hydroxide (NaOH) without and with addition of hydroxylamine (NH2OH). 10M NaOH and 12% NH2OH are used for this study. The effect of NH2OH is investigated on the etch rate, etched surface roughness and morphology, and the undercutting at mask edges aligned along < 112 > direction. These are the major etching characteristics, which should be studied in a wet anisotropic etchant. A 3D laser scanning microscope is utilized to measure the surface roughness, etch depth, and undercutting length, while the etched surface morphology is examined using a scanning electron microscope (SEM). The incorporation of NH2OH in NaOH significantly enhances the etch rate and the undercutting at the mask edges that do not consist of {111} planes. To fabricate freestanding structure (e.g., microcantilever) on Si{111} wafer, high undercutting at < 112 > mask edges is desirable to reduce the release time. Moreover, the effect of etchant age on the abovementioned etching characteristics are investigated. The etch rate and undercutting reduce significantly with the age of the modified NaOH. The present paper reports very interesting results for the applications in wet bulk micromachining of Si{111}.

Automated summary

This paper reports the wet anisotropic etching characteristics of Si{111} in sodium hydroxide (NaOH) with and without the addition of hydroxylamine (NH2OH). The effect of NH2OH on the etch rate, etched surface roughness and morphology, and undercutting at mask edges aligned along < 112 > direction is investigated. It is found that the incorporation of NH2OH significantly enhances the etch rate and the undercutting at mask edges that do not consist of {111} planes.