4.7 Article

Organic-Inorganic Hybrid Thermoset-Based Dual Tone-Type Photosensitive Material

Journal

ACS APPLIED POLYMER MATERIALS
Volume 4, Issue 12, Pages 8731-8739

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsapm.2c01049

Keywords

dual tone-type photosensitive materials; hexafluoroisopropylalcohol; organic-inorganic hybrid thermoset; photochemical acid generator; siloxane network

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This paper presents the development of an organic-inorganic hybrid thermoset-based dual tone-type photosensitive material, which can form both positive and negative patterns by changing the patterning process. The solubility of the material was controlled by three factors: copolymer composition, polymer composition contents, and process conditions. The solubility changes were confirmed by various analyses. Thin coating films on silicon wafers showed good adhesion and heat resistance. This material is expected to be used in the production of permanent film materials for high-density semiconductor packages.
This paper describes the development of an organic- inorganic hybrid thermoset-based dual tone-type photosensitive material which can be used for the formation of both a positive tone-type pattern and a negative tone-type pattern by simply changing the patterning process. A combination of three types of solubility controls was used to realize the dual tone-type material; copolymer composition, polymer composition contents, and process conditions were optimized based on the determination of solubility in an alkaline developer. Furthermore, the proposed mechanism of the solubility changes was confirmed by 1H nuclear magnetic resonance and Fourier transform infrared analyses. Thin coating films on silicon wafers prepared similarly by the procedures to prepare positive and negative patterns (with ultraviolet exposure without any photomask, without development) and subsequent heat treatment at 230 degrees C showed good adhesion to the silicon wafers and high heat resistance. Since this material can form linkages with silicon wafer surfaces and can be used to form fine and complicated patterns using a wide range of exposure doses, it is expected to be applied to permanent film materials such as interlayer dielectrics and protective films for high-density semiconductor packages.

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