4.7 Article

Microscale Hybrid Additive Manufacturing of Ultra-Fine, Embedded Cu/Ag(shell)-P4VP(core) Grid for Flexible Transparent Electrodes

Journal

ADVANCED MATERIALS TECHNOLOGIES
Volume 8, Issue 8, Pages -

Publisher

WILEY
DOI: 10.1002/admt.202201580

Keywords

EFD microscale 3D printing; electroless plating; embedded metal mesh; flexible transparent electrodes; shell-core grid

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A simple and cost-effective process for fabricating high-performance flexible transparent electrodes (FTEs) with ultra-fine embedded Cu/Ag(shell)-P4VP(core) conductive grid is proposed. The produced FTE exhibits excellent properties, such as ultra-fine line width, low surface roughness, excellent mechanical stability, and good environmental stability. The flexible electroluminescent device fabricated with this FTE shows great potential for flexible optoelectronic applications.
Flexible transparent electrodes (FTEs) with embedded metal mesh composed of composite materials or structures have excellent comprehensive performance, which has attracted extensive attention, but it also brings great challenges to its manufacturing. Here, a simple and cost-effective fabrication process free of template, vacuum processes is proposed for high-performance FTEs with ultra-fine embedded Cu/Ag(shell)-P4VP(core) conductive grid via a microscale hybrid additive manufacturing technique. The produced FTE exhibits excellent properties with a sheet resistance of 2.5 omega, a transmittance of 93% at a line pitch of 250 mu m, and an ultra-fine line width of 4 mu m, low surface roughness (R-a approximate to 5.28 nm), and excellent mechanical stability (no change in R-s after 100 adhesion and 150 scratch tests). The FTEs expose only a few conductive areas, which make it excellent environmental stability (no change in R-s after exposure to humidity environment for 72 h). The flexible electroluminescent device fabricated with this FTE has good bending and luminescent properties, showing great potential for flexible optoelectronic applications.

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