4.7 Article

Computationally Guided DIW Technology to Enable Robust Printing of Inks with Evolving Rheological Properties

Journal

ADVANCED MATERIALS TECHNOLOGIES
Volume 8, Issue 3, Pages -

Publisher

WILEY
DOI: 10.1002/admt.202201707

Keywords

4D printing; conductive elastomers; direct ink writing; magnetorheological elastomers; multifunctional materials

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Soft multifunctional materials with mechanical sensing or actuation in response to physical stimuli are important for bioengineering and soft electronics applications. However, manufacturing complex shapes with inks that change properties during printing remains a challenge. To address this, a hybrid theoretical-experimental framework using ink writing technology is proposed to optimize printability of time-dependent viscosity inks. The method eliminates the need for additives and is validated by printing magnetorheological elastomers and conductive soft materials.
Soft multifunctional materials allow for mechanical sensing or actuation as a response to multiple physical stimuli, while providing material stiffness that mimic soft biological tissues (approximate to 1-10 kPa). One of the main bottlenecks in the state of the art relates to the difficulty for manufacturing complex shapes when using inks whose properties significantly change over the printing time. To overcome this issue, the implementation of a hybrid (theoretical-experimental) framework that allows optimal printability of time-dependent viscosity inks by using the direct ink writing technology. Although the rheological properties of the ink vary during printing time, a combination of theoretical and experimental methods provides evolving printing conditions that ensure efficient and robust printability over the process. The method removes the need of introducing additives to the ink. To enable this technology, an in-house printer that provides flexibility to modulate the extrusion pressure over printing time is developed. The method is validated by manufacturing magnetorheological elastomers and conductive soft materials for specific bioengineering and soft electronics applications.

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