4.2 Article

Effect of plasma spraying parameters on wear and scratch resistance of Al2O3-40 Wt.% YSZ ceramic coatings deposited on Ti-6Al-4 V alloy

Journal

JOURNAL OF THE AUSTRALIAN CERAMIC SOCIETY
Volume 59, Issue 2, Pages 379-390

Publisher

SPRINGER
DOI: 10.1007/s41779-023-00835-5

Keywords

Plasma spray coating; Alumina-Zirconia; Scratch resistance; Sliding wear

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The effect of critical plasma spraying parameter (CPSP) and spraying distance on scratch and wear characteristics of alumina-zirconia coatings deposited on Ti-6Al-4 V was studied. Wear resistance, scratch resistance, microstructure, and hardness of the coatings were evaluated through various analyses. The increase in CPSP and spraying distance improved the wear and scratch resistance as well as micro hardness of the coatings. Coatings deposited at a distance of 100 mm exhibited the highest scratch and wear resistance. The wear mechanisms observed included splat delamination, microchipping, and microcracking.
Plasma-spraying ceramic coatings are widely employed in plenty of practical applications, where superior tribological properties and resistivity towards corrosion are needed. So an effect of critical plasma spraying parameter (CPSP) and spraying distance on scratch and wear characteristics are studied by depositing Al2O3-40wt%8YSZ powders on the Ti-6Al-4 V at various CPSP and spraying distances. Also, the wear test is conducted using a ball-on-plate reciprocating type wear tester at 37 ? in a simulated body fluid environment. Phase analysis, microstructure analysis, porosity, microhardness, and scratch resistance are also carried out for studying the performance. The result reveals that, increase of CPSP reduces the wear rate and improves resistance towards scratch and micro hardness of the coatings. These coatings at 100 mm spraying distance exhibits higher scratch and wear resistance. Consequently, the examination of the wear specimens demonstrates the critical mechanism of wear in the ceramic coatings such as splat delamination, microchipping, and microcracking.

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