Oxidation thermodynamics and oxidation kinetics analysis of Au-20Sn solder

Article Materials Science, Multidisciplinary

A reactive molecular dynamics simulation study on corrosion behaviors of carbon steel in salt spray

Licheng Du et al.

Summary: Reactive molecular dynamics simulations were used to study the corrosion behaviors, charge distribution, and oxide growth mechanisms of carbon steel. Results showed that salt spray density plays a dominant role in the corrosion of carbon steel, with higher density corresponding to more severe corrosion. Decarburization phenomenon leads to a decrease in carbon content, and corrosion behavior mainly occurs before 600 ps, with the corrosion rate determined by the chemical reaction rate.

COMPUTATIONAL MATERIALS SCIENCE (2022)

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Article Materials Science, Multidisciplinary

Concomitant oxidation-diffusion-creep processes for stress generation and suppression of oxide-alloy interfacial instabilities

Wei Niu et al.

Summary: This study shows that tensile biaxial stress in the substrate alloy, generated by oxidation-diffusion-creep processes, stabilizes oxide layers and suppresses rumpling or compositional variation at the interface. By compensating growth stress in the oxide layer, the substrate tensile stress influences the growth of high-growth-stress oxide phases over low-growth-stress ones, as suggested by stress-domain analysis. These findings have been validated in experiments with superalloys and carburized or irradiated stainless steels under various oxidation conditions.

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2021)

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Article Engineering, Electrical & Electronic

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test

K. E. Akoda et al.

Summary: This paper investigates the effect of temperature on the corrosion behavior of lead-free solder alloy during a neutral salt spray test, focusing on SAC305 solder alloy Ball Grid Array components. The study reveals that an increase in temperature leads to an earlier onset of corrosion on solder balls, with visible deterioration after 72 hours at 25°C, 48 hours at 35°C, and 24 hours at 45°C. The presence of tin, oxygen, and chloride ions on solder balls is observed, and the thermal Arrhenius Law is used to estimate acceleration factors and activation energy values for predicting the lifetime of lead-free solder balls.

MICROELECTRONICS RELIABILITY (2021)

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Article Engineering, Electrical & Electronic

Microstructure, mechanical properties and corrosion analysis of Sn-0.7Cu+Ga solders joints developed using green concentrated solar energy soldering method

Puskaraj D. Sonawwanay et al.

Summary: The study revealed that the CSES solder joints had similar tensile response, bending strength and microhardness to CSI solder joints, but their performance decreased after corrosion. The addition of Gallium improved the microstructure and mechanical properties of the joints, establishing CSES technique as a green technology and prospective alternative to CSI method.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021)

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Article Materials Science, Multidisciplinary