Related references
Note: Only part of the references are listed.
Article
Engineering, Electrical & Electronic
Laili Wang et al.
Summary: In this article, a novel source inductance optimization method is proposed for Cu-clip bonding to address the challenges of current sharing and thermal coupling. A Cu-clip bonded half-bridge multichip SiC power module is designed and fabricated to verify the effectiveness of the method. The optimization of power source inductances using extra modification paths on Cu clips helps mitigate current and loss imbalances.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Chang-Chun Lee et al.
Summary: Given the increasing demand for power density and lightweight specifications, a power module with an insulated metal substrate (IMS) is proposed for personal vehicles. The IMS-type module with epoxy molding passes automotive-grade reliability tests, while the module with silicone gel molding fails. Finite element analysis shows that the coefficient of thermal expansion between the IMS and molding material has a significant impact on the mechanical behavior of the solder layer.
JOURNAL OF ELECTRONIC PACKAGING
(2022)
Article
Engineering, Electrical & Electronic
Anup Anurag et al.
Summary: The use of high-voltage silicon carbide (SiC) devices simplifies and ensures the reliability of converter systems. However, careful design and consideration of auxiliary parts are required. This article investigates the operation of high-voltage SiC MOSFETs and discusses the design considerations, advantages, and challenges of medium-voltage converter systems. Successful tests demonstrate continuous field operation and the potential for advancement and deployment of medium-voltage SiC devices.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Chemistry, Multidisciplinary
Haaris Rasool et al.
Summary: This paper proposes a fast and accurate electro-thermal model for an existing Simrod three-phase inverter used in electric vehicles (EVs). The study focuses on analyzing and modeling the inverter's electro-thermal characteristics for multi-applications. A passive filter design approach is presented for the inverter's DC and AC sides. The developed simulation model is validated and compared with experimental data, showing its importance in designing and optimizing high-efficiency inverters at specific temperature and power range.
APPLIED SCIENCES-BASEL
(2022)
Article
Engineering, Electrical & Electronic
Yu Zhou et al.
Summary: This article proposes a generative method to optimize the layout of multichip silicon carbide power modules, and validates its capability through a designed and fabricated half-bridge module.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Asif Imran Emon et al.
Summary: Gallium nitride (GaN) high electron mobility transistors (HEMTs) are superior power semiconductor devices compared to silicon (Si) counterparts. However, traditional wire-bonded packaging limits their benefits, requiring improved packaging structures. This study presents a globally optimized double-sided cooled, gate driver integrated 650-V/60- A GaN half-bridge power module, achieving lower power loop inductance and thermal resistance.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION
(2022)
Article
Engineering, Electrical & Electronic
Jack S. Knoll et al.
Summary: This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The package demonstrates superior electrical performance, thermal performance, and power density.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Review
Energy & Fuels
Amit Kumar et al.
Summary: Power electronic systems using wide band gap (WBG) materials offer the potential for more efficient and higher power density power converters. This paper reviews the development and applications of SiC and GaN power devices, and discusses the associated challenges.
Proceedings Paper
Computer Science, Artificial Intelligence
Riya Paul et al.
Summary: A novel SiC double-sided cooling power module with integrated functions such as gate drivers, capacitors, and sensors is proposed. It utilizes a 45-degree vertical connection block for optimal heat dissipation path and a low temperature co-fired ceramic interposer for mechanical strength and electrical isolation. The module features a non-isolated single-channel driver with variable drive strength control and a GMR-based contactless current measurement solution. The power module has low power loop inductance and thermal resistance.
2022 20TH IEEE INTERREGIONAL NEWCAS CONFERENCE (NEWCAS)
(2022)
Article
Engineering, Electrical & Electronic
Arman Ur Rashid et al.
Summary: This paper presents an efficient physics-based electro-thermal model for modeling Silicon Carbide (SiC) power MOSFETs. The model accurately simulates the temperature dependency of characteristics and includes various nonlinearities. It also incorporates temperature-dependent breakdown mechanism for reliable system design.
IEEE OPEN JOURNAL OF POWER ELECTRONICS
(2022)
Review
Engineering, Electrical & Electronic
Ming Liu et al.
Summary: This paper presents a comprehensive review of double-sided cooled packaging technology for automotive power modules. The technical details and innovative features of state-of-the-art automotive power modules from research institutes and major industry manufacturers are evaluated, and their potential for commercial vehicles is discussed.
IEEE OPEN JOURNAL OF POWER ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Chao Ding et al.
Summary: This article introduces a method of reducing thermomechanical stresses in power modules using porous interposers made of low-temperature sintered silver, and designs and fabricates a double-side cooled half-bridge module. By utilizing these interposers, thermal stresses at vulnerable interfaces are reduced, simplifying the module fabrication process.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Review
Engineering, Electrical & Electronic
Rayna Alizadeh et al.
Summary: This article reviews and analyzes some previously proposed power modules in terms of their impact on system-level applications, and describes a co-design methodology that considers module system compatibility to improve the performance of power semiconductor devices.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Article
Energy & Fuels
Ali Roshanghias et al.
Summary: Copper sinter paste has been proven as a reliable die-attach material for high-power electronic packaging. The study shows that copper sinter paste can be used to create top-side interconnects, replacing wire bonds, with comparable performance. Additionally, finite element analysis demonstrates that planar sinterconnects can improve thermal management by reducing ohmic losses in power packages.
Article
Computer Science, Information Systems
Javier Ballestin-Fuertes et al.
Summary: This paper analyzes the requirements for power semiconductor characteristics in future smart applications, comparing the existing wide bandgap materials (SiC and GaN) with promising alternatives under research (Ga2O3, AlN, etc.), and concludes that although SiC and GaN are currently the only available WBG materials, they may be replaced by others in the near future.
Article
Engineering, Electrical & Electronic
Syam Madhusoodhanan et al.
Summary: The InGaN/GaN MQW structure has been demonstrated as a possible solution for high-temperature photodiode applications, with high-temperature spectral and noise analysis conducted. Results show that the structure has good photodetector sensitivity at high temperatures under specific conditions.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2021)
Proceedings Paper
Energy & Fuels
Utkarsh Mehrotra et al.
Summary: An increasing number of power circuit designers are focusing on bare die module-level designs to achieve greater circuit integration and better thermal management. Additionally, designers are looking deeper inside power modules to optimize differences and improve gate driver design, power-loop designs, and electro-physical layout. The detailed insights into design decisions and the characterization of power modules aid in understanding variances in parameters and performance effects.
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)
(2021)
Proceedings Paper
Energy & Fuels
Zhongjing Wang et al.
Summary: The importance of designing fixture adapter boards for power electronics to improve measurement accuracy is discussed in this paper. Detailed design procedures are presented and validated through comparisons with commercial fixture adapters, with further discussions and evaluations on enhancing accuracy.
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)
(2021)
Proceedings Paper
Energy & Fuels
Mark Cairnie et al.
Summary: In this study, a finite element method-driven automated numerical optimization technique was used to design field grading structures for a SiC MOSFET power module integrated into a PCB bus bar. The proposed technique resulted in a 30% higher partial discharge inception voltage and reduced the design cycle time from weeks to days, with scalable problem formulation and cost function for wide applicability to other high-voltage, high-density systems.
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)
(2021)
Proceedings Paper
Energy & Fuels
Jacob Gersh et al.
Summary: Direct-bonded aluminum (DBA) multi-layer substrates were fabricated using low-pressure silver sintering to reduce peak electric field strength inside power modules. The voiding content and defect density of the bond are critical to thermal performance and reliability. After 1,000 thermal cycles, minor cracking was observed, but no failures occurred.
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)
(2021)
Article
Mechanics
H-C Cheng et al.
Summary: This study characterizes the switching transients and power losses of silicon power MOSFET and Si powerMOSFET-based three-phase inverter during load cycles. Through numerical modeling and experimental validation, parasitic parameters are extracted, circuit simulation is performed, and switching loss estimation is developed. Parametric study explores the influences on parasitic inductances and switching transients of the power MOSFET package and the switching losses of the three-phase inverter.
JOURNAL OF MECHANICS
(2021)
Review
Engineering, Electrical & Electronic
Haksun Lee et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2020)
Article
Engineering, Electrical & Electronic
Fengze Hou et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2020)
Article
Computer Science, Information Systems
Yuhang Yang et al.
Article
Engineering, Electrical & Electronic
Tristan M. Evans et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2019)
Article
Energy & Fuels
Alberto Castellazzi et al.
Article
Engineering, Electrical & Electronic
Matthew Barlow et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2019)
Article
Engineering, Electrical & Electronic
Sayan Seal et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2018)
Article
Automation & Control Systems
Yu Ren et al.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2017)
Article
Automation & Control Systems
Nan Zhu et al.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2017)
Article
Engineering, Electrical & Electronic
Chad B. O'Neal et al.
JOURNAL OF ELECTRONIC MATERIALS
(2016)
Article
Engineering, Electrical & Electronic
Helong Li et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2016)
Article
Engineering, Electrical & Electronic
Zhenxian Liang et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2014)
