4.7 Article

A Tutorial on High-Density Power Module Packaging

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JESTPE.2022.3232691

Keywords

~Gravimetric power density; packaging; power electronic modules; volumetric power density; wide bandgap (WBG)

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Transportation electrification and grid modernization efforts require power electronic converters, motor drives, and protection systems to meet stringent requirements for power densities. This article provides a tutorial on designing and realizing high-power modules, using the PowerAmerica (PA) module challenge as an example. It discusses the application-driven development process, challenges in multidimensional design, and technologies and strategies for high-power, high-density module realization. The knowledge shared can facilitate the prototype development of new power modules.
Transportation electrification in many forms along with continued grid modernization efforts is placing stringent requirements on volumetric and gravimetric power densities for power electronic converters, motor drives, and protection systems. These requirements flow down to more stringent specifications on power module packages that typically comprise these systems. For instance, the PowerAmerica (PA) Institute issued a module challenge in 2021 to develop a 1.7-kV/1600-A power module within a volume of 100 cm(3) during case of one year. This article describes, in tutorial fashion, how to approach the design and realization of such an aggressive module. It begins from an overview of an application-driven development process of prototypes for power module, including design, fabrication, and evaluation. Then, the PA module is used as a development example to illustrate the detailed challenges faced in the multidimensional design space and explore the technologies and strategies for high-power, high-density module realization. Consequently, the knowledge involved can be transferred and facilitate the prototype development of new power modules.

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