Power Cycling Method for Power Modules With Low Thermal Resistance

Article Engineering, Electrical & Electronic

Lumped Thermal Coupling Model of Multichip Power Module Enabling Case Temperature as Reference Node

Mengqi Xu et al.

Summary: This letter presents a thermal coupling model for IGBT modules, with the case temperature as the reference node, enabling separate modeling of cooling conditions inside and outside the module.

IEEE TRANSACTIONS ON POWER ELECTRONICS (2022)

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Article Engineering, Electrical & Electronic

GaN-Based Multichip Half-Bridge Power Module Integrated on High-Voltage AlN Ceramic Substrate

Carsten Kuring et al.

Summary: This article presents a power electronic system using wide-bandgap GaN transistors, which offers high efficiency and power density. The system integrates the transistors and gate drive stages on a multilayer polycrystalline AlN-substrate to minimize parasitic circuit elements and improve cooling. The results show that compared to a conventional printed circuit board design, the system allows for higher load currents and lower device temperatures.

IEEE TRANSACTIONS ON POWER ELECTRONICS (2022)

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Article Engineering, Electrical & Electronic

In Situ Diagnosis of Wire Bonding Faults for Multichip IGBT Modules Based on the Crosstalk Effect

Wuyu Zhang et al.

Summary: This article introduces a bond wire diagnosis method for multichip insulated gate bipolar transistor (IGBT) modules, which is important for the health monitoring of modular multilevel converters (MMCs). The method leverages the crosstalk phenomenon during switching transitions to detect chip open-circuit faults caused by bond wire lift-off. Two health-sensitive parameters are identified and evaluated through theoretical analysis, circuit simulation, and practical verification. The results demonstrate the feasibility of online monitoring using this method.

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2022)

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Article Engineering, Electrical & Electronic

Single-Phase Five-Level IT-Type NPC Inverter With Improved Efficiency and Reliability in Photovoltaic Systems

Ui-Min Choi et al.

Summary: This article proposes a single-phase IT-type NPC inverter with OLC-PWM to improve the efficiency and reliability of PV energy. The advantages of the proposed inverter in terms of power loss, reliability, and balancing the neutral-point voltage are validated through simulations and experiments.

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2022)

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Article Automation & Control Systems

Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement

Shan Gao et al.

Summary: Bonded interfaces in power converters can face degradation and increased thermal resistances under cyclic loading. To quantify interface reliability across large areas, a nondestructive measurement technique for obtaining a 2-D map of thermal resistance is developed. This technique involves moving a thermal probe across a large bonded substrate and analyzing temperature data to create a thermal structure function.

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS (2021)

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Article Engineering, Manufacturing

Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling

Xing Liu et al.

Summary: This study investigates the influence of the insulated gate bipolar transistor (IGBT) chip-near temperature gradient on failure modes in power cycling tests through finite element simulations and experiments. It was found that adjusting the load current pulse duration and area ratio between the chip region and top side copper can significantly affect the temperature gradient, leading to different dominant failure modes. Experiments confirmed the simulation results, showing that failure modes can indeed shift due to changes in temperature gradient.

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2021)

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Article Engineering, Electrical & Electronic

Limitations and Guidelines for Damage Estimation Based on Lifetime Models for High-Power IGBTs in Realistic Application Conditions

Antonios Antonopoulos et al.

Summary: This article points out the uncertainties in applying a lifetime model to stress patterns deriving from field applications, discussing typical sources of errors and how severely they may impact lifetime estimation.

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2021)

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Article Engineering, Electrical & Electronic