Research on the Processing of Microstructures on Silicon Carbide Surfaces Using a Blowing-Assisted Nanosecond Laser

The properties of high strength, wear resistance, and high brittleness, make silicon carbide (SiC) materials difficult to process by traditional processing methods. The non-traditional processing method of laser processing has emerged as a viable means of processing silicon carbide materials, as it is very suitable for processing hard and brittle materials, and has the additional advantages of no tool wear, no cutting force, and high processing efficiency. However, in conventional laser processing of silicon carbide, oxidation products occur in the processing area, which can hinder the further removal of the material. To avoid the accumulation of oxidation products and improve the laser processing of the groove structure on the silicon carbide surface, a blowing-assisted laser processing method is proposed by this paper. Comparison experiments between conventional and blowing-assisted laser processing were conducted, in which groove structures of different depths and widths were processed. Two models were established based on the experimental results to explain the material removal process. Finally, the array microgroove structures were successfully processed by blowing-assisted laser processing, verifying the feasibility of improving the laser processing capability of microstructures on silicon carbide surfaces with the assistance of blowing.

Automated summary

The properties of silicon carbide (SiC) materials, including high strength, wear resistance, and high brittleness, make them difficult to process using traditional methods. This paper proposes a blowing-assisted laser processing method to improve the laser processing capability of silicon carbide surfaces, successfully processing array microgroove structures.