Journal
NANOMATERIALS
Volume 13, Issue 4, Pages -Publisher
MDPI
DOI: 10.3390/nano13040633
Keywords
high speed; thermal stability; crystallization; PCM
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Phase change memory (PCM), a new storage technology, has advantages in capacity and endurance. This research focuses on improving the thermal stability and switching speed performance of phase change materials. Ta-doped Sb3Te1 alloy demonstrates better thermal stability and faster crystallization rates, making it a promising material for PCM applications.
Phase change memory (PCM), a typical representative of new storage technologies, offers significant advantages in terms of capacity and endurance. However, among the research on phase change materials, thermal stability and switching speed performance have always been the direction where breakthroughs are needed. In this research, as a high-speed and good thermal stability material, Ta was proposed to be doped in Sb3Te1 alloy to improve the phase transition performance and electrical properties. The characterization shows that Ta-doped Sb3Te1 can crystallize at temperatures up to 232 degrees C and devices can operate at speeds of 6 ns and 8 x 10(4) operation cycles. The reduction of grain size and the density change rate (3.39%) show excellent performances, which are both smaller than that of Ge2Sb2Te5 (GST) and Sb3Te1. These properties conclusively demonstrate that Ta incorporation of Sb3Te1 alloy is a material with better thermal stability and faster crystallization rates for PCM applications.
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