Hybrid integration of chipscale photonic devices using accurate transfer printing methods

Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales. (C) 2022 Author(s).

Automated summary

This review provides an overview of transfer printing for integrated photonics applications, including considerations of materials and fabrication processes, efficient optical coupling methods, and high-accuracy inter-layer alignment. State-of-the-art integration demonstrations are presented, covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Future developments in the technology for dense multi-materials integration at wafer scales are discussed.