Related references
Note: Only part of the references are listed.Corrosion behavior of Sn-based lead-free solder alloys: a review
Shuai Li et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Influence of cobalt content on microstructure and corrosion performance of extruded Sn-9Zn solder alloys
Jiang Shou-li et al.
JOURNAL OF CENTRAL SOUTH UNIVERSITY (2020)
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders
G. Chen et al.
MICROELECTRONICS RELIABILITY (2020)
Corrosion-induced degradation and its mechanism study of Cu-Al interface for Cu-wire bonding under HAST conditions
Chien-Pan Liu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2020)
Corrosive degradation evaluation of semi-parallel wire cables with high-density polyethylene sheath breaks
Yujie Yu et al.
ENGINEERING FAILURE ANALYSIS (2020)
Electrochemical Corrosion of SAC Alloys: A Review
Ali Gharaibeh et al.
METALS (2020)
How Copper Wire Material Additive Elements Effect the Reliability of Wire Bonded Contacts in HAST testing
Robert Klengel et al.
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) (2020)
Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Robert Klengel et al.
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) (2020)
Corrosion of Copper Wire bonded Packages by Chlorine Containing Foreign Particles
Varughese Mathew et al.
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) (2020)
ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS
Bokai Liao et al.
SURFACE REVIEW AND LETTERS (2019)
Correlation between microstructure and corrosion behaviour of Bi-Zn solder alloys
Rudimylla S. Septimio et al.
CORROSION ENGINEERING SCIENCE AND TECHNOLOGY (2019)
Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys
Wenchao Yang et al.
MATERIALS (2019)
Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring
A. A. El-Daly et al.
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE (2019)
Sliding Interconnection for Flexible Electronics with a Solution-Processed Diffusion Barrier against a Corrosive Liquid Metal
Dong-Youn Shin et al.
ADVANCED ELECTRONIC MATERIALS (2019)
Corrosion of Gold by a Nanoscale Gold and Copper Beltlike Structure
Hidetaka Sawada et al.
JOURNAL OF PHYSICAL CHEMISTRY C (2019)
The Effect of Rare Earths Additions on the Microstructure and the Corrosion Behavior of Sn-0.7Cu-0.075Al Solder Alloy
Wenchao Yang et al.
MATERIALS (2019)
Morphology, resistivity and corrosion behavior of tin coatings plated from citric acid bath
Ashutosh Sharma et al.
MATERIALS RESEARCH EXPRESS (2019)
Corrosion characterization of Sn-Zn solder: a review
Muhammad Firdaus Mohd Nazeri et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2019)
Microstructural and damp-heat corrosion characteristics of Zn-2 wt% Al solder alloys containing trace Ag
Runzhen Yu et al.
MATERIALS RESEARCH EXPRESS (2019)
Investigation of mechanism of corrosion resistance of Pd coated Cu wire joint by pseudo process
Shunsuke Nemoto et al.
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) (2019)
Electrochemical corrosion in electric energy meters
Zhang Leping et al.
PROCEEDINGS OF 2019 14TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS (ICEMI) (2019)
The Morphology of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles
Fakhrul Rifdi Omar et al.
2018 UKM FST POSTGRADUATE COLLOQUIUM (2019)
Innovative Socketable and Surface-Mountable BGA interconnections
Omkar Gupte et al.
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2019)
Reduction of Ag Corrosion Rate during Decapsulation of Ag Wire Bond Packages
Young-Ja Kim et al.
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2019)
A new reliable, corrosion resistant gold-palladium coated copper wire material
Sandy Klengel et al.
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2019)
Effect of trace Mn modification on the microstructure and corrosion behavior of Sn-9Zn solder alloy
Jian-Chun Liu et al.
MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION (2018)
Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution
Zhenghong Wang et al.
CORROSION SCIENCE (2018)
Electrochemical Behavior of Sn-9Zn-xTi Lead-Free Solders in Neutral 0.5M NaCl Solution
Zhenghong Wang et al.
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE (2018)
Ab initio surface properties of Ag-Sn alloys: implications for lead-free soldering
Gabriele Saleh et al.
PHYSICAL CHEMISTRY CHEMICAL PHYSICS (2018)
Microstructure and properties of Cu-Sn-Zn-TiO2 nano-composite coatings on mild steel
Weidong Gao et al.
SURFACE & COATINGS TECHNOLOGY (2018)
Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging
Chun-Hao Chen et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2018)
Chloride-to-sulfate mass ratio: Practical studies in galvanic corrosion of lead solder
Caroline K. Nguyen et al.
JOURNAL AMERICAN WATER WORKS ASSOCIATION (2018)
The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N2-Free Conditions
Gun Rae Kim et al.
MATERIALS TRANSACTIONS (2018)
BGA substrate outgassing negative impact study on Cu wire bonding
Hanmin Zhang et al.
MICROELECTRONICS INTERNATIONAL (2017)
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
Mingna Wang et al.
MICROELECTRONICS RELIABILITY (2017)
An Evaluation of Effects of Molding Compound Properties on the Reliability of Ag Wire Bonded Components
Keisuke Yazawa et al.
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) (2017)
Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments
Pradeep Lall et al.
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) (2017)
Accelerated SLID Bonding for Fine-Pitch Interconnects with porous Microstructure
Joerg Meyer et al.
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) (2017)
Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-bonded Device Assembly
O. Chyan et al.
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) (2017)
Surface metallization of Cu/Ni/Au coatings on diamond/Cu composite materials for heat sink application
D. G. Liu et al.
CERAMICS INTERNATIONAL (2017)
The Effect of Substrate Microstructure on the Heat-Affected Zone Size in Sn-Zn Alloys Due to Adjoining Ni-Al Reactive Multilayer Foil Reaction
R. J. Hooper et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition
Adeline B. Y. Lim et al.
MICROELECTRONICS RELIABILITY (2016)
Microstructural Indicators for Prognostication of Copper-Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity
Pradeep Lall et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016)
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
Chih-Hsin Tsai et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016)
Eternal Packages: Liquid Metal Flip Chip Devices
Assane Ndieguene et al.
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2016)
Corrosion Behavior of Cu-Al Intermetallic Compounds in Copper Wire Bonding in Chloride-containing Accelerated Humidity Testing
Dong Liu et al.
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2016)
Multiphysics Life-Prediction Model Based On Measurements of Polarization Curves for Copper-Aluminum Intermetallics
Pradeep Lall et al.
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2016)
Corrosion of laser joined silicon carbide in gasification environment
S. Schaafhausen et al.
ADVANCES IN APPLIED CERAMICS (2015)
Distribution system water age can create premise plumbing corrosion hotspots
Sheldon Masters et al.
ENVIRONMENTAL MONITORING AND ASSESSMENT (2015)
Effect of palladium on the mechanical properties of Cu-Al intermetallic compounds
Adeline B. Y. Lim et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Initial Corrosion Behavior and Mechanism of PCB-HASL in Typical Outdoor Environments in China
Kangkang Ding et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Effect of graphene nanosheets on the corrosion behavior of Sn-Ag-Cu solders
L. Y. Xu et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)
A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding
Enrico Mick et al.
MATERIALS (2015)
Investigation of Acetic Acid Corrosion Impact on Printed Solar Cell Contacts
Achim Kraft et al.
IEEE JOURNAL OF PHOTOVOLTAICS (2015)
Effects of PCB Substrate Surface Finish, Flux, and Phosphorus Content on Ionic Contamination
M. Bacior et al.
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE (2015)
Investigation of Electrochemical Migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni Solder Alloy in HNO3 Solution
C. Sarveswaran et al.
2015 UKM FST POSTGRADUATE COLLOQUIUM (2015)
Methods for predicting corrosion on electronic products
M. Lindgren et al.
CORROSION ENGINEERING SCIENCE AND TECHNOLOGY (2014)
Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules
Ju-Hee Kim et al.
INTERNATIONAL JOURNAL OF PHOTOENERGY (2014)
Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
Mingna Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2014)
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
Mingna Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2014)
Enhancement of interfacial reaction between solid iron and molten tin by mechanical actions
H. Kato et al.
MATERIALS SCIENCE AND TECHNOLOGY (2014)
Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test
N. I. M. Nordin et al.
MICROELECTRONICS RELIABILITY (2014)
The degradation of multi-crystalline silicon solar cells after damp heat tests
Wonwook Oh et al.
MICROELECTRONICS RELIABILITY (2014)
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters
Adeline B. Y. Lim et al.
MICROELECTRONICS RELIABILITY (2014)
Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board
Chih-Kai Huang et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder
Y. D. Han et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Copper Wire Bonding Concerns and Best Practices
Preeti Chauhan et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
The corrosion characteristics and solderability of immersion tin coatings on copper
A. Arazna et al.
MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION (2013)
Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere
Zhong Yan et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2013)
The effect of moisture on the degradation mechanism of multi-crystalline silicon photovoltaic module
T. H. Kim et al.
MICROELECTRONICS RELIABILITY (2013)
The effect of encapsulant discoloration and delamination on the electrical characteristics of photovoltaic module
N. C. Park et al.
MICROELECTRONICS RELIABILITY (2013)
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
Chwee Sim Goh et al.
CRYSTALS (2013)
Palladium-coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding
A. B. Y. Lim et al.
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2013 (CSTIC 2013) (2013)
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
Thomas R. Bieler et al.
JOURNAL OF ELECTRONIC MATERIALS (2012)
Creep-Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures
Kittichai Fakpan et al.
JOURNAL OF ELECTRONIC MATERIALS (2012)
A Comparison of Corrosion Behavior of a Super Duplex Stainless Steel and an Austenitic Stainless Steel in a Molten Sn-3.0Ag-0.5Cu Lead-Free Solder
Huei-Sen Wang et al.
MATERIALS TRANSACTIONS (2012)
The Study on Defects of 6-Inch Cylinder by Electro Magnetic Acoustic Transducer (EMAT)
M. K. Chang et al.
ADVANCED SCIENCE LETTERS (2011)
Notch effect on creep-fatigue life for Sn-3.5Ag solder
Mineo Nozaki et al.
ENGINEERING FRACTURE MECHANICS (2011)
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper
F. Wafula et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2010)
Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish
Hitoshi Sakurai et al.
MATERIALS TRANSACTIONS (2010)
Elucidation of the relationship between the electrochemical migration susceptibility of SnPb solders for PCBs and the composition of the resulting dendrites
Y. R. Yoo et al.
METALS AND MATERIALS INTERNATIONAL (2010)
Influence of Electrochemical Properties on Electrochemical Migration of SnPb and SnBi Solders
Y. R. Yoo et al.
METALS AND MATERIALS INTERNATIONAL (2010)
Directional diffusion of atoms in metal strips/bump interconnects of flip chip
Lu Yu-Dong et al.
ACTA PHYSICA SINICA (2010)
Share Paper
