High Reflectivity and Thermal Conductivity Ag-Cu Multi-Material Structures Fabricated via Laser Powder Bed Fusion: Formation Mechanisms, Interfacial Characteristics, and Molten Pool Behavior

Ag and Cu have different advantages and are widely used in key fields due to their typical highly electrical and thermal conductive (HETC) properties. Laser powder bed fusion (LPBF), an innovative technology for manufacturing metallic multi-material components with high accuracy, has expanded the application of Ag-Cu in emerging high-tech fields. In this study, the multi-material sandwich structures of Ag7.5Cu/Cu10Sn/Ag7.5Cu were printed using LPBF, and the formation mechanism, interface characteristics, and molten pool behavior of the Ag7.5Cu/Cu10Sn (A/C) and Cu10Sn/Ag7.5Cu (C/A) interfaces were studied to reveal the influence of different building strategies. At the A/C interface, pre-printed Ag7.5Cu promoted Marangoni turbulence at a relatively low energy density (E-A/C = 125 J/mm(3)). Due to the recoil pressure, the molten pool at the A/C interface transformed from a stable keyhole mode to an unstable keyhole mode. These phenomena promoted the extensive migration of elements, forming a wider diffusion zone and reduced thermal cracking. At the C/A interface, the molten pool was rationed from the conduction mode with more pores to the transition mode with fewer defects due to the high energy density (E-C/A = 187.5 J/mm(3)). This work offers a theoretical reference for the fabrication of HETC multi-material structures via LPBF under similar conditions.

Automated summary

Ag and Cu have typical highly electrical and thermal conductive (HETC) properties, and are widely used in key fields. Laser powder bed fusion (LPBF) has expanded the application of Ag-Cu in emerging high-tech fields. This study printed multi-material sandwich structures of Ag7.5Cu/Cu10Sn/Ag7.5Cu using LPBF, and studied the formation mechanism, interface characteristics, and molten pool behavior of the interfaces to reveal the influence of different building strategies.