Fabrication and Properties of InGaZnO Thin-Film Transistors Based on a Sol-Gel Method with Different Electrode Patterns

The preparation of thin-film transistors (TFTs) with InGaZnO (IGZO) channels using sol-gel technology has the advantages of simplicity in terms of process and weak substrate selectivity. We prepared a series of TFT devices with a top contact and bottom gate structure, in which the top contact was divided into rectangular and circular structures of drain/source electrodes. The field-effect performance of TFT devices with circular pattern drain/source electrodes was better than that with a traditional rectangular structure on both substrates. The uniform distribution of the potential in the circular electrode structure was more conducive to the regulation of carriers under the same channel length at different applied voltages. In addition, with the development of transparent substrate devices, we also constructed a hafnium oxide (HfO2) insulation layer and an IGZO active layer on an indium tin oxide conductive substrate, and explored the effect of circular drain/source electrodes on field-effect properties of the semitransparent TFT device. The IGZO deposited on the HfO2 dielectric layer by spin-coating can effectively reduce the surface roughness of the HfO2 layer and optimize the scattering of carriers at the interface in TFT devices.

Automated summary

The use of sol-gel technology to prepare thin-film transistors (TFTs) with InGaZnO (IGZO) channels offers the advantages of simple process and weak substrate selectivity. The field-effect performance of TFT devices with circular drain/source electrodes was found to be superior to those with traditional rectangular electrodes, due to the more uniform distribution of potential in the circular electrode structure.