Journal
ACS SUSTAINABLE CHEMISTRY & ENGINEERING
Volume 11, Issue 3, Pages 1178-1189Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acssuschemeng.2c06598
Keywords
phase change materials (PCMs); biobased thermoplastic; thermal conductivity; mechanical properties
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In this study, a novel phase change material (PCM) of erythritol (ET)-grafted polylactic acid (PLA) (ETPLA) was prepared to combine the properties of a biobased thermoplastic polymer and the heat storage of PCM. The thermally conductive ETPLA composites were fabricated using a hybrid filler system of oxidized carbon fiber (CF-OH) and aluminum nitride (AlN) through injection molding. The composites exhibited high through-plane thermal conductivity, enhanced mechanical properties, and a large latent heat, making them suitable for thermal management systems of next-generation electronic devices.
In this study, an advanced phase change material (PCM) was fabricated to combine the properties of a biobased thermoplastic polymer and the heat storage of PCM to overcome the limitations of the existing PCM composites. The novel PCM of erythritol (ET)-grafted polylactic acid (PLA) (ETPLA) was prepared by the in situ polymerization of ET and PLA. The thermally conductive ETPLA composites were fabricated by injection molding using a hybrid filler system of oxidized carbon fiber (CF-OH) and aluminum nitride (AlN), which showed a high through-plane thermal conductivity of 4.25 W/mK, a tensile strength of 16.4 MPa (1953% enhancement comparing pure ET), an elongation at break of 4.4% (189% enhancement comparing pure ET), and latent heat of 170.7 J/g. Thus, the ETPLA/CF-OH/AlN composites facilitate efficient thermal management to combine heat saving and heat dissipation through the large latent heat and high thermal conductivity. Thus, the fabricated PCM composites have potential applications in thermal management systems of next-generation electronic devices.
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