Soft and thermally conductive gels by introducing free-movable polymer chains into network

The rapid development of electronic devices has been putting forward requirements for higher thermal conductivity, softness, and stability of thermal interface materials. However, thermal interface materials simultaneously achieving softness, stability, and thermal conductivity is still challenging. Here, we propose a strategy of introducing free-movable polymer chains to prepare thermally conductive gels possessing high thermal conductivity (6.91 W m(-1) K-1), good softness (Young's modulus similar to 400 KPa, and stretchability increasing 262.4%). The high thermal conductivity is due to the high addition of microscale spherical Aluminum. The good softness is attributed to the free-movable poly (ethylene propylene diene), which reduces the interaction between polymer networks. When thermally conductive gels simulate practical applications, it shows excellent heat-dissipation ability and thermal stability after 1000 heating-cooling cycles. This work provides a simple strategy for constructing thermally conductive gels with high performance and promotes their potential applications in the thermal management of electronic devices.

Automated summary

The rapid development of electronic devices has led to higher requirements for thermal interface materials in terms of thermal conductivity, softness, and stability. However, achieving softness, stability, and thermal conductivity simultaneously is still challenging. In this study, a strategy of introducing free-movable polymer chains was proposed to prepare thermally conductive gels with high thermal conductivity, good softness, and increased stretchability. The high thermal conductivity was attributed to the addition of microscale spherical Aluminum, while the good softness was due to the free-movable poly (ethylene propylene diene) that reduced the interaction between polymer networks. The thermally conductive gels showed excellent heat-dissipation ability and thermal stability after 1000 heating-cooling cycles, demonstrating their potential applications in the thermal management of electronic devices.