4.6 Article

Electrical property-microstructure of copper interconnects printed by localized pulsed electrodeposition (L-PED)

Journal

MATERIALS LETTERS
Volume 330, Issue -, Pages -

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ELSEVIER
DOI: 10.1016/j.matlet.2022.133364

Keywords

Mesoscale printing of metals; Localized electrodeposition; Interconnects; Nanotwinned microstructure; Electrical characterization

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Printing processes allow for the printing of high conductivity metals on a small scale.
Printing processes that enable printing high conductivity metals at small scale (

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