4.7 Article

Design and fabrication of micro and nano surface structures for enhancing metal-polymer adhesion using femtosecond laser treatment

Journal

MATERIALS & DESIGN
Volume 224, Issue -, Pages -

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2022.111349

Keywords

Micro and nano surface structures; Surface treatment; Adhesion strength; Laser; LIPSS; Copper; Electronic packaging

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This study found that deep microgrooves improved adhesion strength due to the anchor effect, but there was a limitation in enhancing adhesion strength based on the aspect ratio of the microgroove. LIPSS formation on the mountaintop of the microgroove was effective, while LIPSS on the valley of the microgroove was ineffective.
This study investigated the effects of micro- and nanostructures on the adhesion strength between copper and an encapsulating mold compound (EMC). The shape of the microgrooves was designed based on fracture mechanics theory, and the effect of laser-induced periodic structure surface (LIPSS) formation on the microgroove was investigated using numerical simulations. The designed surface profiles were fabricated using femtosecond laser treatments, and the adhesion strength between copper and the EMC was evaluated. The results show that deep microgrooves improved the adhesion strength owing to the anchor effect. However, the aspect ratio between the pitch and depth of the microgroove had a limitation in enhancing the adhesion strength. The formation of LIPSSs on the mountaintop of the microgroove was very effective; however, an LIPSS on the valley of the microgroove was ineffective. Numerical analyses revealed that LIPSSs suppressed the shear deformation of the EMC and worked as resistance to interface delamination. Based on the findings obtained in this study, combining micro- and nano-scale surface structure formation with femtosecond laser treatments is an effective and eco-friendly method for improving adhesion strength. (c) 2022 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

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