Characterisation of the first digital modules with RD53B-CMS readout chips for the Phase-2 Upgrade of the CMS Inner Tracker

To cope with the challenges posed by theHigh-Luminosity LHC, the CMS experiment will feature a new silicon tracker. The modules of the upgraded inner tracker are hybrid silicon pixel modules based on a new readout chip, developed by the RD53 collaboration. Compared to the readout chip of the current pixel detector, the RD53 chip is capable of sustaining higher hit rates and radiation levels, as well as enabling the use of serial-powering chains. The qualification of the latest version of this chip (RD53B) is underway, and it will lead to the final version of the readout chip to be used in the CMS inner tracker during the HL-LHC. First digital modules featuring the RD53B-CMS chip have been assembled in 2022 (the term digital module denotes a module assembly with readout chips, but without sensors bonded to them). This contribution presents results of tests on these first prototype modules.

Automated summary

To meet the challenges of the High-Luminosity LHC, the CMS experiment will utilize a new silicon tracker with hybrid silicon pixel modules based on the RD53 readout chip. This upgraded chip can handle higher hit rates, radiation levels, and enables the use of serial-powering chains. Testing is underway for the latest version of the RD53 chip, and the results will inform the final version to be used in the CMS inner tracker during the HL-LHC. The first digital modules featuring the RD53B-CMS chip have been assembled in 2022, and this contribution presents the results of tests on these prototypes.