Journal
JOURNAL OF APPLIED PHYSICS
Volume 132, Issue 24, Pages -Publisher
AIP Publishing
DOI: 10.1063/5.0133144
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Funding
- DAAD [ST34-57507871-PKZ:91768126]
- German Research Foundation (DFG) [DI 1419/13-2, DI 1419/16-1, WI 1899 32-2]
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This study systematically investigates the grain boundary diffusion in an additively manufactured equiatomic CoCrFeMnNi high-entropy alloy. It is found that the grain boundaries in the as-manufactured state exhibit significantly enhanced diffusivities and non-equilibrium segregation, which can be attributed to the non-equilibrium state of grain boundaries after rapid solidification. The study also reveals that the grain boundary diffusion rates are almost independent of the scanning/building strategy used for specimen's manufacturing.
Grain boundary diffusion in an additively manufactured equiatomic CoCrFeMnNi high-entropy alloy is systematically investigated at 500 K under the so-called C-type kinetic conditions when bulk diffusion is completely frozen. In the as-manufactured state, general (random) grain boundaries are found to be characterized by orders-of-magnitude enhanced diffusivities and a non-equilibrium segregation of (dominantly) Mn atoms. These features are explained in terms of a non-equilibrium state of grain boundaries after rapid solidification. The grain boundary diffusion rates are found to be almost independent on the scanning/building strategy used for the specimen's manufacturing, despite pronounced microstructure differences. Grain boundary migration during diffusion annealing turned out to preserve the non-equilibrium state of the interfaces due to continuous consumption of the processing-induced defects by moving boundaries. Whereas the kinetic non-equilibrium state of the interfaces relaxes after annealing at 773 K, the non-equilibrium segregation is retained, being further accompanied by a nano-scale phase decomposition at the grain boundaries. The generality of the findings for additively manufactured materials is discussed. Published under an exclusive license by AIP Publishing.
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