Oxygen-Free Compound Casting of Aluminum and Copper in a Silane-Doped Inert Gas Atmosphere: A New Approach to Increase Thermal Conductivity

Novel aluminum-copper compound castings devoid of oxide layers at the interface between the joining partners were developed in order to increase the thermal conductivity of the hybrid component. Due to the natural oxide layers of both aluminum and copper, metallurgical bonds between such bi-metal castings cannot be easily achieved in conventional processes. However, in an atmosphere comparable to extreme high vacuum created by using silane-doped inert gas, metallurgical bonds between the active surfaces of both aluminum and copper can be realized without additional coatings or fluxes. An intermetallic was created between aluminum and copper. Thus, very high thermal conductivities could be obtained for these hybrid castings, exceeding those of conventionally joined samples considerably. The intermetallic phase seams emerging between the joining partners were investigated using scanning electron microscopy and X-ray diffraction. The reduction of casting temperatures resulted in narrower intermetallic phase seams and these in turn in a much lower contact resistance between the two joining partners. This effect can be utilized for increasing the heat transfer capabilities of compound casting components employed for cooling heat sources such as high-power light-emitting diodes.

Automated summary

Novel aluminum-copper compound castings without oxide layers were developed to enhance thermal conductivity of hybrid components. Metallurgical bonds between aluminum and copper were achieved in an atmosphere comparable to extreme high vacuum created using silane-doped inert gas. The resulting intermetallic phase seams between the joining partners contributed to significantly higher thermal conductivities compared to conventionally joined samples.