Related references
Note: Only part of the references are listed.IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
Pascal Vivet et al.
IEEE JOURNAL OF SOLID-STATE CIRCUITS (2021)
Optimization of thermal aware multilevel routing for 3D IC
P. Sivakumar et al.
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING (2020)
Design Space Exploration for Chiplet-Assembly-Based Processors
Saptadeep Pal et al.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS (2020)
Enabling Optimal Power Generation of Flow Cell Arrays in 3D MPSoCs with On-Chip Switched Capacitor Converters
Halima Najibi et al.
2020 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2020) (2020)
Modeling and Decoupling the GPU Power Consumption for Cross-Domain DVFS
Joao Guerreiro et al.
IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS (2019)
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays
Artem Aleksandrovich Andreev et al.
IEEE TRANSACTIONS ON COMPUTERS (2018)
3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs
Arvind Sridhar et al.
IEEE TRANSACTIONS ON COMPUTERS (2014)
A Dynamic Model of Switched-Capacitor Power Converters
Lukas Mueller et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2014)
Online Thermal Control Methods for Multiprocessor Systems
Francesco Zanini et al.
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS (2013)
Dynamic Power Management for Multidomain System-on-Chip Platforms: An Optimal Control Approach
Paul Bogdan et al.
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS (2013)
A combined sensor placement and convex optimization approach for thermal management in 3D-MPSoC with liquid cooling
Francesco Zanini et al.
INTEGRATION-THE VLSI JOURNAL (2013)
Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
Mohamed M. Sabry et al.
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS (2011)
Opportunities and Challenges for 3D Systems and Their Design
Philip Emma et al.
IEEE DESIGN & TEST OF COMPUTERS (2009)
Share Paper
