Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating

Through-hole copper deposition technology for nano-micro hole printed circuit boards (PCBs) is of great importance in the electronic industry. Achieving efficient copper electrodeposition using trace amounts of plating additives is a very challenging problem. Here, four anthraquinone (AQS) quaternary ammonium salts have been synthesised based on anthraquinone yellow pigments. These four compounds were functionalised for the first time as promising levelers for through-hole copper electrodeposition. Electrochemical tests, theoretical calculations and Molecular dynamics simulation demonstrate that the AQS-Qnl compounds have the most excellent copper deposition inhibition and electrode adsorption capacity among the four compounds. TP value measurement, SEM, XRD tests confirmed that AQS-Qnl can actually have high through-hole filling and excellent levelling performance in practical PCB plating. Based on this, The levelling mechanism of AQS-Qnl leveler was analysed by using electrostatic potential, average local ionisation energy and polarisation rate and the mechanism of AQS-Qnl's interaction with PEG and SPS in practical plating was proposed using galvanostatic measurements.

Automated summary

Through-hole copper deposition technology is crucial for PCBs in the electronic industry. An anthraquinone-based quaternary ammonium salt was synthesized and functionalized as a promising leveler for efficient copper electrodeposition. Experimental and theoretical results demonstrated that it exhibits excellent copper deposition inhibition and electrode adsorption capacity. Practical tests confirmed its high through-hole filling and levelling performance in PCB plating.