4.7 Article

Simultaneous optimization of the thermal conductivity and mechanical properties of epoxy resin composites through PES and AgNP functionalized BNs

Journal

COMPOSITES PART B-ENGINEERING
Volume 248, Issue -, Pages -

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2022.110373

Keywords

Epoxy resin; PES; AgNP; Thermal conductivity; Mechanical properties

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In this study, polyether sulfone (PES) and silver nanoparticles functionalized boron nitride nanoplates (AgBNs) were used to enhance the thermal conductivity and mechanical properties of epoxy resin (EP) composites. The addition of silver nanoparticles helped increase the interfacial contact of boron nitride nanoplates, improving the heat conduction paths. The results showed that the inclusion of AgBNs significantly increased the thermal conductivity of the composites, and the introduction of PES improved the mechanical properties.
In this work, polyether sulfone (PES) and silver nanoparticles functionalized boron nitride nanoplates (AgBNs) were adopted to simultaneously improve the thermal conductivity and mechanical properties of the epoxy resin (EP) composites. The 0D silver nanoparticles (AgNP), successfully manufactured by the reduction reaction of DMF and AgNO3, were conductive to increase the interfacial contact of 2D boron nitride nanoplates (BNs), thus also improving the heat conduction paths of AgBNs. SEM and optical microscopy observations revealed that the 3D continuous thermal conduction paths of AgBNs were constructed based on PES/EP bi-continuous phase structures, and were perfected as the AgBNs contents increased. Consequently, the thermal conductivity of PES-EP/AgBNs achieved a maximum value of 0.54 W m-1 K-1 at 10 wt% AgBNs loading, which was much higher than that of both EP/AgBNs (0.45 W m-1 K-1) and EP/BNs (0.36 W m-1 K-1) at the same filler content. Meanwhile, the fracture mode of PES-EP/AgBNs changed gradually from brittle to ductile, and PES-EP/AgBNs further exhibited satisfactory tensile strength, flexural strength and fracture toughness, in comparison with EP/AgBNs due to the introduction of PES. This approach reconciles efficiently the conflict of thermal conduc-tivity and mechanical properties of epoxy resin composites, presenting conceivable applications in high per-formance thermal conductivity devices.

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