Low frequency vibration attenuation of meta-orthogrid sandwich panel with high load-bearing capacity

A new type of meta-orthogrid sandwich panel (MOSP) with spring-mass resonators is proposed and designed. Instead of creating bandgaps where vibration attenuates by changing the core of the sandwich structure, the spring-mass subsystems are added to the skin to achieve vibration attenuation of the structure. Thus, the bearing capacity of the orthogrid sandwich panel is completely retained. The boundaries of the bandgap are obtained theoretically through dispersion analysis. The vibration transmission spectrums are calculated through finite element (FE) simulation to evaluate the vibration isolation properties of the MOSP. The influence of the position of the input and output ends on vibration transmission curves of the panel is discussed. Moreover, the effect of the core stiffness change on the vibration transmissibility of the upper and lower sides of the MOSP is investigated by changing the size of the lattice unit-cells. Finally, the samples are fabricated through 3D printing, and then experiments are conducted to validate the results obtained from theoretical calculation and FE simulation. This work will be useful for the design of sandwich structures with both low-frequency vibration attenuation and load bearing requirements.

Automated summary

A new type of meta-orthogrid sandwich panel (MOSP) with spring-mass resonators is proposed and designed in this study. By adding spring-mass subsystems to the skin, the vibration attenuation of the structure is achieved while retaining the bearing capacity of the panel. Theoretical analysis and finite element simulation are used to determine the bandgap boundaries and evaluate the vibration isolation properties of the MOSP. The experimental validation of theoretical and simulation results is carried out through 3D printing. This work is significant for the design of sandwich structures with both vibration attenuation and load bearing requirements.