A sandwich-structured ultra-flexible Pva-co-PE/Cu nanofiber composite film with excellent electrical conductivity, electromagnetic shielding properties, and environmental stability

A sandwich-structured ultra-flexible copper clad film based on nanofiber film has been successfully prepared via plasma induction, which combines super flexibility, low resistivity, hydrophobicity and outstanding electromag-netic shielding properties with potential applications in wearable circuit substrate boards. Acrylic acid was grafted onto Pva-co-PE nanofiber film by plasma irradiation induction, and silver ions were loaded on the surface of fiber film by electrostatic coordination between silver ions and carboxylic acid particles. Then copper was deposited on the surface of fiber film by chemical reduction reaction to obtain flexible copper-clad film. The resistivity of the obtained flexible copper-clad film is only 42.7 mu omega*cm, which is as good as that of the conductor. The EMI per-formance is above 55 dB, and the film has good hydrophobicity (150.6 degrees). After 100 cycles of compression, the flexible copper-clad film still possessed outstanding performance. The flexible copper-clad film exhibited super stability and had broad application prospect in the flexible intelligent wearable field that will be popularized soon.

Automated summary

A sandwich-structured ultra-flexible copper clad film based on nanofiber film has been successfully prepared via plasma induction, which combines super flexibility, low resistivity, hydrophobicity and outstanding electromagnetic shielding properties. The film has a resistivity as low as that of a conductor and shows excellent electromagnetic shielding performance and hydrophobicity. It maintains outstanding performance even after multiple compression cycles.