Related references
Note: Only part of the references are listed.Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
Yongtong Li et al.
JOURNAL OF ELECTRONIC PACKAGING (2021)
Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array
Yuanchen Hu et al.
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME (2021)
A silicon-diamond microchannel heat sink for die-level hotspot thermal management
Danish Ansari et al.
APPLIED THERMAL ENGINEERING (2021)
Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink
Yongtong Li et al.
APPLIED THERMAL ENGINEERING (2020)
Experimental investigation of heat transfer for pulsating flow of GOPs-water nanofluid in a microchannel
Chong Xu et al.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2020)
Enhancing thermal-hydraulic performance of counter flow mini-channel heat sinks utilizing secondary flow: Numerical study with experimental validation
Amitav Tikadar et al.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2020)
Water immersion cooling of high power density electronics
Patrick Birbarah et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2020)
Enhancing the performance of aluminum foam heat sinks through integrated pin fins
Yongtong Li et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2020)
A novel composite pinfin heat sink for hotspot mitigation
Danish Ansari et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2020)
Parametric study on thermal and hydraulic characteristics of inter-connected parallel and counter flow mini-channel heat sink
Amitav Tikadar et al.
APPLIED THERMAL ENGINEERING (2019)
Experimental investigation of the impact of geometrical surface modification on spray cooling heat transfer performance in the non-boiling regime
Azzam S. Salman et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2019)
Experimental investigation of multiwall carbon nanotube/paraffin based heat sink for electronic device thermal management
Amin Farzanehnia et al.
ENERGY CONVERSION AND MANAGEMENT (2019)
Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
Heng Tang et al.
APPLIED ENERGY (2018)
Hotspot thermal management using a microchannel-pinfin hybrid heat sink
Danish Ansari et al.
INTERNATIONAL JOURNAL OF THERMAL SCIENCES (2018)
Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations
Dawei Yang et al.
APPLIED THERMAL ENGINEERING (2017)
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
Daniel Lorenzini et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2016)
Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach
A. M. Bayomy et al.
INTERNATIONAL JOURNAL OF THERMAL SCIENCES (2016)
Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
Yong Han et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2014)
Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium
E. Farsad et al.
JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS (2014)
Numerical simulation of heat transfer enhancement in wavy microchannel heat sink
H. A. Mohammed et al.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2011)
Heat transfer characteristics of synthetic jet impingement cooling
Mangesh Chaudhari et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2010)
Performance analysis of nanofluid-cooled microchannel heat sinks
Tsung-Hsun Tsai et al.
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW (2007)
Thermal analysis on metal-foam filled heat exchangers. Part I: Metal-foam filled pipes
W. Lu et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2006)
Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages
HY Zhang et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2005)
Three-dimensional numerical optimization of a manifold microchannel heat sink
JH Ryu et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2003)
Finned metal foam heat sinks for electronics cooling in forced convection
A Bhattacharya et al.
JOURNAL OF ELECTRONIC PACKAGING (2002)
Numerical investigation of forced convection heat transfer in porous media using a thermal non-equilibrium model
PX Jiang et al.
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW (2001)
Forced convection in high porosity metal foams
VV Calmidi et al.
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME (2000)
Share Paper
