CMOS-compatible integration of telecom band InAs/InP quantum-dot single-photon sources on a Si chip using transfer printing

We report the hybrid integration of a telecom band InAs/InP quantum-dot (QD) single-photon source on a CMOS-processed Si photonics chip using transfer printing. The integration technique allows for the assembly of photonic components in a pick-and-place operation and therefore can introduce them on Si photonics chips after completing the entire CMOS-compatible fabrication processes. We demonstrate telecom single-photon generation from an InAs/InP QD integrated on Si and its coupling into a waveguide. We also demonstrate the integration of a QD on a fiber-pigtailed Si chip and single-photon output through the optical fiber, showing a novel pathway for modularizing solid-state quantum light sources.

Automated summary

We present the hybrid integration of an InAs/InP quantum-dot (QD) single-photon source with a CMOS-processed Si photonics chip using transfer printing. This integration technique enables the assembly of photonic components through a pick-and-place operation, allowing for their introduction onto Si photonics chips after completing the entire CMOS-compatible fabrication processes. We demonstrate the generation of telecom single photons using an InAs/InP QD integrated on Si and their coupling into a waveguide. We also showcase the integration of a QD on a fiber-pigtailed Si chip and the single-photon output through the optical fiber, presenting a new pathway for modularizing solid-state quantum light sources.