4.8 Article

Nanometer-Thick Oxide Semiconductor Transistor with Ultra-High Drain Current

Journal

ACS NANO
Volume 16, Issue 12, Pages 21536-21545

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.2c10383

Keywords

atomic layer deposition; oxide semiconductor; ultrahigh current; back-end-of-line compatibility; charge neutrality level; nanometer-thick transistor

Funding

  1. Semiconductor Research Corporation (SRC) nCORE Innovative Materials and Processes for Accelerated Compute Technologies (IMPACT) Center
  2. Air Force Office of Scientific Research (AFOSR)
  3. SRC/Defense Advanced Research Projects Agency (DARPA) Joint University Microelectronics Program (JUMP) Applications and Systems-driven Center for Energy Efficient integrated Nano Technologies (ASCENT) Center
  4. NSERC
  5. Compute Canada

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In this study, an In2O3 transistor grown by atomic layer deposition (ALD) at back-end-of-line (BEOL) compatible temperatures is demonstrated to have a record high drain current, surpassing all known transistors. Experimental and theoretical analysis reveal that high carrier density and high electron velocity contribute to the superior on-state performance in these ALD In2O3 transistors.
High drive current is a critical performance parameter in semiconductor devices for high-speed, low-power logic applications or high-efficiency, high-power, high-speed radio frequency (RF) analogue applications. In this work, we demonstrate an In2O3 transistor grown by atomic layer deposition (ALD) at back-end-of-line (BEOL) compatible temperatures with a record high drain current in planar FET, exceeding 10 A/mm, the performance of which is 2-3 times better than all known transistors with semiconductor channels. A high transconductance reaches 4 S/mm, recorded among all transistors with a planar structure. Planar FETs working ballistically or quasi-ballistically are exploited as one of the simplest platforms to investigate the intrinsic transport properties. It is found experimentally and theoretically that a high carrier density and high electron velocity both contribute to this high on-state performance in ALD In2O3 transistors, which is made possible by the high-quality oxide/oxide interface, the metal-like charge-neutrality-level (CNL) alignment, and the high band velocities induced by the low density-of-state (DOS). Experimental Hall, I-V, and split C-V measurements at room temperature confirm a high carrier density of up to 6-7 x 10(13)/cm(2) and a high velocity of about 10(7) cm/s, well-supported by density functional theory (DFT) calculations. The simultaneous demonstration of such high carrier concentration and average band velocity is enabled by the exploitation of the ultrafast pulse scheme and heat dissipation engineering.

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