Preparation of polypropylene-based thermally conductive composites via multiple injection compression molding method

With the increasing power consumption of electronic devices, this leads to a huge challenge in terms of heat dissipation. In order to solve the problem of heat dissipation in electronic equipment and to improve the stability and life of electronic equipment. This paper reports polypropylene (PP)/carbon fiber (CF)/Al2O3, PP/CF, PP/CF/SiO2 composites with excellent properties, which are prepared by two different methods: injection molding (IM) and injection compression (IC). The PP/CF/Al2O3 and PP/CF/SiO2 composites contain a constant 5 wt% of Al2O3 and SiO2 fillers. Different processing methods are used to prepare the composites in order to investigate the effect of different processing methods on the mechanical properties and thermal conductivity of the composites. The PP/CF/Al2O3 composite (0.475 W/(mK)) prepared by IC method (6 x 0.5 mm) has good thermal conductivity, 15.90% higher than that of the PP/CF/Al2O3 composite (0.410 W/(m.K)) prepared by IM method. In addition, the PP/CF/Al2O3 composite has good mechanical properties (tensile strength and elongation at break are 4.22% and 14.176 MPa respectively). This method of IM has great potential for the continuous production of thermally conductive composites.

Automated summary

With the increasing power consumption of electronic devices, the challenge of heat dissipation has become a major issue. This study focuses on the preparation of polypropylene/carbon fiber/Al2O3, polypropylene/carbon fiber, and polypropylene/carbon fiber/SiO2 composites with excellent properties using injection molding and injection compression methods. The results show that the composites prepared by injection compression have better thermal conductivity and mechanical properties compared to those prepared by injection molding.