4.8 Article

Mechanically flexible polyimide foams with different chain structures for high temperature thermal insulation purposes

Journal

MATERIALS TODAY PHYSICS
Volume 26, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.mtphys.2022.100720

Keywords

Polyimide foam; Molecular structure; Foaming behavior; Mechanical flexibility; Thermal insulation

Funding

  1. National Natural Science Foundation of China [52103040]
  2. National Key Laboratory of Advanced Composites, Key Laboratory of Advanced Functional Composite Technology [6142906200513]
  3. China Postdoctoral Science Foundation [2020M673217]
  4. State Key Laboratory of Polymer Materials Engineering [sklpme2020-3-06]

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Mechanically flexible polyimide foams with exceptional high temperature thermal insulation properties were successfully fabricated by microwave-assisted foaming and thermal imidization process using polyester ammonium salt precursor powders with different molecular chain structures. The introduction of copolymerized dianhydride structure improved the cellular structure and mechanical flexibility of the foams. The micron-scale cellular structure of the foams was determined by melt viscosity, chain rigidity, volatile content, and foaming temperatures.
Mechanically flexible polyimide foams (PIFs) with exceptional high temperature thermal insulation properties were fabricated by microwave-assisted foaming and post thermal imidization process, using polyester ammonium salt (PEAS) precursor powders which consisted of different molecular chain structures as the derivatives. A comparison of foaming behavior, pore morphology, mechanical and thermal insulation properties between PIFs prepared with mono-dianhydride and copolymerized dianhydride structures was systematically studied. Results showed that the optimum foaming temperatures of PEASs was in the range of 85-150 degrees C, which correlated with the volatilization of solvents such as H2O, tetrahydrofuran and methanol. The introduction of copolymerized dianhydride structure altered the chain rigidity and melt viscosity of PEAS, which improved the cellular structure and mechanical flexibility of PIFs. Moreover, the micron-scale cellular structure of PIFs was determined by melt viscosity, chain rigidity, volatile content and foaming temperatures. The PIFs exhibited low apparent densities (25-30 kg/m(3)), high open cell rate (95-97%) and mechanical flexibility (compression/release recover rate: 96-99%). All PIFs possessed exceptional thermal stability and thermal insulation properties which can be targeted for thermal insulation applications in the fields of aerospace, transportation, and microelectronics among others.

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