4.7 Article

Micro 3D printing of a functional MEMS accelerometer

Journal

MICROSYSTEMS & NANOENGINEERING
Volume 8, Issue 1, Pages -

Publisher

SPRINGERNATURE
DOI: 10.1038/s41378-022-00440-9

Keywords

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Funding

  1. Royal Institute of Technology

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Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries. However, manufacturing specialized MEMS devices at low- and medium-scale volumes is challenging. This study demonstrates the viability of 3D printing functional MEMS devices using two-photon polymerization and metal evaporation, addressing the limitations of conventional MEMS manufacturing.
Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconductor manufacturing techniques. However, these techniques are not viable for the costefficient manufacturing of specialized MEMS devices at low- and medium-scale volumes. Thus, applications that require custom-designed MEMS devices for markets with low- and medium-scale volumes of below 5000-10,000 components per year are extremely difficult to address efficiently. The 3D printing of MEMS devices could enable the efficient realization and production of MEMS devices at these low- and medium-scale volumes. However, current micro-3D printing technologies have limited capabilities for printing functional MEMS. Herein, we demonstrate a functional 3D-printed MEMS accelerometer using 3D printing by two-photon polymerization in combination with the deposition of a strain gauge transducer by metal evaporation. We characterized the responsivity, resonance frequency, and stability over time of the MEMS accelerometer. Our results demonstrate that the 3D printing of functional MEMS is a viable approach that could enable the efficient realization of a variety of custom-designed MEMS devices, addressing new application areas that are difficult or impossible to address using conventional MEMS manufacturing.

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