Journal
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 21, Issue -, Pages 2947-2964Publisher
ELSEVIER
DOI: 10.1016/j.jmrt.2022.10.103
Keywords
Superalloy; Deformation behavior; Constitutive model; Dynamic recrystallization; Numerical simulation
Funding
- National Science and Technology Major Project on High -end Numerically Controlled Machine Tools and Basic Manufacturing Technology
- National Natural Science Foundation of China
- [2017ZX04004001]
- [52005294]
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This paper conducted hot compression experiments to analyze the deformation behavior and dynamic recrystallization of FGH96 at high temperature and strain rate conditions. Two strain modified viscoplastic constitutive models were established and proven to accurately reflect the deformation behavior and suitable for numerical simulation of IFW.
FGH96 nickel-based superalloy is widely used in manufacturing high-temperature components of aero engine, and welded by inertia friction welding (IFW). The materials welded by IFW suffer high temperature just below melting point and strain rate above 10 s(-1). The deformation behavior and microstructures of FGH96 at severe deformation conditions are not sufficiently studied. In this paper, hot compression experiments with temperature of 1273-1473 K and strain rate of 0.01-30 s(-1) were carried out to analyze the deformation behavior and dynamic recrystallization (DRX) of FGH96. Different from low strain rate researches, the continuous dynamic recrystallization was found complete and dominant at high strain rate and inferred to be stress driven. Two strain modified viscoplastic constitutive models which cover different DRX mechanisms were established by polynomial fitting or defining strain factor. The flow stresses calculated by both constitutive models were in good agreement with the experimental results. The finite element simulation application showed that the two constitutive models can accurately reflect the deformation behavior, and are suitable for the numerical simulation of IFW. (C) 2022 The Authors. Published by Elsevier B.V.
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