Related references
Note: Only part of the references are listed.Semiconductor technologies for 5G implementation at millimeter wave frequencies - Design challenges and current state of work
Sagar Juneja et al.
ENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH (2021)
Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study
Rafiq Asghar et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2020)
Three-dimensional CFD simulation of the stencil printing performance of solder paste
M. S. Rusdi et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)
SMT Assembly Inspection Using Dual-Stream Convolutional Networks and Two Solder Regions
Young-Gyu Kim et al.
APPLIED SCIENCES-BASEL (2020)
Voids Reduction in Fine Pitch SiP Assembly Through Optimization of Reflow Parameters
Kenny Chiong Kung Chuan et al.
2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (2020)
The effect of solder paste volume on solder joint shape and self-alignment of passive components
Ke Pan et al.
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) (2020)
A generalized variational approach for predicting contact angles of sessile nano-droplets on both flat and curved surfaces
Warren J. Jasper et al.
JOURNAL OF MOLECULAR LIQUIDS (2019)
A conditional justification for the determination of surface energy of solids using contact angle methods
Ankitha E. Bangera et al.
MATERIALS CHEMISTRY AND PHYSICS (2019)
SMT defect classification by feature extraction region optimization and machine learning
Ji-Deok Song et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2019)
Corner Point-Based Coarse-Fine Method for Surface-Mount Component Positioning
Lifei Bai et al.
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS (2018)
Improving operator evaluation skills for defect classification using training strategy supported by attribute agreement analysis
Carlos Marques et al.
MEASUREMENT (2018)
Fully integrated and portable semiconductor-type multi-gas sensing module for IoT applications
Ji-Hoon Suh et al.
SENSORS AND ACTUATORS B-CHEMICAL (2018)
Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications
Chien-Yi Huang
SOLDERING & SURFACE MOUNT TECHNOLOGY (2018)
Label-/tag-free traceability of electronic PCB in SMD assembly based on individual inherent surface patterns
Benedikt Wigger et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2018)
Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties
Xiaoxuan Tu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
A Review on Solder Reflow and Flux Application for Flip Chip
Sarveshvaran Suppiah et al.
3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017) (2017)
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere
C. Goncalves et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)
Screen printed passive components for flexible power electronics
Aminy E. Ostfeld et al.
SCIENTIFIC REPORTS (2015)
Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy
Suchart Chantaramanee et al.
ADVANCED MATERIALS DESIGN AND MECHANICS II (2013)
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study
Tsung-Nan Tsai
APPLIED SOFT COMPUTING (2012)
Tombstone Initiation Model for Small Form-Factor Surface Mount Passives
Nachiket Raravikar et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2012)
The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction
Chien-Yi Huang et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2011)
Enhancing optimal feeder assignment of the multi-head surface mounting machine using genetic algorithms
Shaoyuan Li et al.
APPLIED SOFT COMPUTING (2008)
DMAIC approach to improve the capability of SMT solder printing process
Ming-Hsien Caleb Li et al.
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING (2008)
Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly
Ming-Hung Shu et al.
MICROELECTRONICS RELIABILITY (2006)
Share Paper
