Sputter deposition of high electrical resistivity Au-Ta alloy coatings on rotating substrates

Article Chemistry, Physical

Effect of substrate tilt on sputter-deposited AuTa films

A. M. Engwall et al.

Summary: The study investigated the effects of substrate tilt on properties of gold-tantalum alloy films deposited by magnetron sputtering. It was found that the deposition rate and film density decrease with increasing substrate tilt angle, leading to changes in film properties such as porosity and electrical resistivity. The critical tilt angle for increased resistivity was determined to be between 40 and 60 degrees.

APPLIED SURFACE SCIENCE (2021)

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Article Physics, Applied

Sputtered Au-Ta films with tunable electrical resistivity

L. B. Bayu Aji et al.

Summary: Gold-tantalum alloy films are promising for use in magnetized inertial confinement fusion. Through systematic study, an alloy with around 80% tantalum was found to form a metallic glass exhibiting high electrical resistivity at low temperatures, making it suitable for applications requiring pulsed magnetic fields.

JOURNAL OF PHYSICS D-APPLIED PHYSICS (2021)

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Article Physics, Applied

Gold-tantalum alloy films deposited by high-density-plasma magnetron sputtering

J. H. Bae et al.

Summary: Gold-tantalum alloy films deposited by high-power impulse magnetron sputtering show properties affected by substrate tilt and bias, with increased tilt leading to decreased film thickness, density, compressive stress, and electrical conductivity. Substrate bias influences the formation of body-centered cubic phase, affecting film properties such as density, electrical conductivity, and residual stress. The changes observed are attributed to metal atom ionization effects rather than distributions of energies and angles, enabling control over properties for specific applications.

JOURNAL OF APPLIED PHYSICS (2021)

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Article Physics, Fluids & Plasmas