4.7 Article

Adhesive curing effect of bonded piezoelectric transducer on electromechanical impedance-based concrete structural damage detection

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Publisher

SAGE PUBLICATIONS LTD
DOI: 10.1177/14759217221118514

Keywords

Curing effect; adhesive layer; electromechanical impedance; piezoelectric sensor; structural damage detection; concrete structure

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This study investigated the curing effect of the adhesive layer on the electromechanical admittance (EMA)-based detection of concrete structural damage. The results showed that the singular shift in EMA spectra during adhesive curing can be turned into three typical shifts when structural damage occurs, validating the analytical results.
Complete understanding of the adhesive curing effect of a bonded piezoelectric lead zirconate titanate (PZT) sensor on the electromechanical admittance (EMA, inverse of impedance) facilitates the accurate diagnosis of structural damages when employing the impedance technique for structural health monitoring. This article analytically and experimentally investigated the curing effect of adhesive layer on the EMA-based concrete structural damage detection. Curing effect was theoretically incorporated into shearing mechanism of adhesive layer to formulate a new one-dimensional PZT-structural impedance model. Analytical analysis of the curing effect on the EMA signature as well as the EMA-based damage diagnosis was calculably interpreted through the model. Proof-of-concept experiment was performed on testing a four-point bending reinforced concrete (RC) beam bonded with multiple PZT patches under adhesive curing. Experimental results demonstrated that singular shift in the EMA spectra under adhesive curing could be turned into three typical shifts when structural damage occurred, which cogently validated the analytical results. Quantifiable signal index further provided useful information for the identification of crack occurrence, progression, and reinforcement yielding of the RC beam. Results of this study potentially promoted the real-life engineering applications of impedance technique inclusive of deficient adhesive condition.

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