Journal
SOLAR ENERGY
Volume 246, Issue -, Pages 113-118Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.solener.2022.09.037
Keywords
Spray -coating; Silicon dioxide; Passivation; n plus emitter; Silicon solar cell
Categories
Funding
- National Centre for Photovoltaic Research and Education (NCPRE) at IIT Bombay
- Ministry of New and Renewable Energy of the Government of India [31/09/2015-16/PVSE-RD]
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Inefficient passivation of phosphorous diffused emitter is one of the limiting factors contributing to lower efficiency in advanced p-type silicon solar cells. Stack of SiO2 and SiNX with the former as an intermediate layer beneath SiNX provides better emitter passivation in comparison to SiNX film alone. Spray SiO2/SiNX is shown to be a viable alternative to thermal SiO2/SiNX stack for emitter passivation in silicon solar cells.
Inefficient passivation of phosphorous diffused emitter is one of the limiting factors contributing to lower efficiency in advanced p-type silicon solar cells. Stack of SiO2 and SiNX with the former as an intermediate layer beneath SiNX provides better emitter passivation in comparison to SiNX film alone. Thermal oxide is reported to provide the best passivation, but it is not industrially viable. We demonstrate spray SiO2/SiNX as a viable alternative to thermal SiO2/SiNX stack. A few nanometer thin (similar to 6.1 nm) spray SiO2 film was first time demonstrated on micrometer sized textured pyramid with full coverage over an entire deposited area. The passivation of symmetrical (n+-p-n+) structure shows iV,,, similar to 660 mV and passivation uniformity over the entire wafer area for both the stacks. V,,, similar to 630 mV is achieved on cells with spray and thermal SiO2 as a passivating layer. Similar front passivation is further verified by overlapping IQE in the shorter wavelength range. Therefore, incorporating SiO2 film deposited via an industrially viable spray-coating process as a passivating layer at the front provides overall cell performance similar to the thermally grown SiO2.
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