Journal
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 34, Issue 23, Pages 5462-5466Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2016.2618419
Keywords
Confocal microscopy; depth measurement; diameter measurement; optical interferometry
Funding
- Development of Next Generation Converging Measurement Standards and Technology for Dimensional Metrology [16011002]
- Development of Application Technologies of Physical Measurement Standards [16011012]
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To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy alignment. According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07 mu m and 48.255 mu m with the expanded uncertainties of 0.20 mu m (k = 2) and 37 nm (k = 2), respectively.
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