High-efficiency microdrilling of glass by parallel transient and selective laser processing with spatial light modulator

To use glass as the substrate material in next-generation large-scale integrations and biochips, the high-speed fabrication of high-aspect-ratio microholes is necessary. Transient and selective laser (TSL) processing signifi-cantly reduces the processing time per hole. To further improve the processing efficiency, parallel TSL processing using a spatial light modulator is proposed in this study. Two 100-mu m depth holes are successfully machined in parallel, in 50 mu s. Furthermore, the process control parameters are investigated through high-speed observation and the laser irradiation conditions required for processing are clarified. Parallel processing of three or more holes and depth control of each hole is expected to be realized in future.

Automated summary

This study proposes a method for parallel laser processing using a spatial light modulator, successfully fabricating high-aspect-ratio microholes on a glass substrate. By investigating control parameters and laser irradiation conditions, the processing efficiency is further improved, and it is expected that parallel processing of more holes and depth control of each hole can be achieved in the future.