Related references
Note: Only part of the references are listed.Bondability of Pd and Au Containing Ag-Alloy Wires on Au Pads for LED Package
Jui-Hung Yuan et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2020)
The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N2-Free Conditions
Gun Rae Kim et al.
MATERIALS TRANSACTIONS (2018)
Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire
Yi-Wei Tseng et al.
MICROELECTRONICS RELIABILITY (2015)
Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire
Tung-Han Chuang et al.
SCRIPTA MATERIALIA (2012)
The effect of Pd and Cu in the intermetallic growth of alloy Au wire
HS Chang et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)