4.7 Article

Immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structures generate exceptional strength-conductivity and thermal stability combination in Cu-based composites

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2022.144228

Keywords

Cu-based materials; Nanolamellar structure; Thermal stability; High strength; High conductivity

Funding

  1. National Natural Science Foundation of China
  2. start-up fund for new researchers of Jiangxi University of Science and Technology
  3. [52001146]
  4. [jxxjbs18036]
  5. [YC2022-S630]

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This study proposes an effective strategy to achieve high strength, high conductivity, and excellent thermal stability simultaneously in Cu-based materials. By constructing an immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structure using accumulative roll bonding technique, the researchers successfully overcome the trade-off dilemma between these desirable properties. The resulting nanostructure exhibits exceptional property combination, including high tensile strength, excellent electrical conductivity, and mechanical and thermal stability.
It is of significance, but still remains a key challenge, to realize simultaneously high strength, high conductivity and excellent thermal stability in Cu-based materials, as these desirable properties often display a mutually exclusive relationship with each other. Here we propose an effective strategy to overcome this trade-off dilemma by constructing an immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structure in Cu-based materials using accumulative roll bonding (ARB) technique. The resultant immiscible tri-phase Cu/Ag/Cu/Nb nano-lamellar structure with an average lamellar spacing of 20 nm produces an exceptional property combination: high tensile strength exceeding 1.0 GPa combined with excellent electrical conductivity above 80% IACS (In-ternational Annealed Cu Standard), while maintaining mechanical and thermal stability up to 700 degrees C for 10h. These desirable properties originate from the synergistic contributions from the unusually high density of immiscible Cu/Ag and Cu/Nb heterophase interfaces, the low density of defects accumulated within the layers and the unique immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar structure. Our results demonstrate the con -current improvement of several mutually exclusive properties in Cu-based materials including strength-thermal stability, and strength-electrical conductivity, and thus represent a promising route to engineering high per-formance nanostructured materials.

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