4.8 Article

Hydrogen-Induced Restructuring of a Cu(100) Electrode in Electroreduction Conditions

Journal

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
Volume 144, Issue 42, Pages 19284-19293

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/jacs.2c06188

Keywords

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Funding

  1. National Science Foundation CBET [2103116]
  2. DOE Office of Science [DE-AC02-06CH11357]
  3. Directorate For Engineering
  4. Div Of Chem, Bioeng, Env, & Transp Sys [2103116] Funding Source: National Science Foundation

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Atomistic insight into the restructuring of the electrochemical interface under different potentials and adsorbate coverages is gained from first principles. The study reveals the formation of a shifted-row reconstruction on Cu(100) under electroreduction conditions induced by hydrogen adsorption. The findings provide valuable understanding for the design of Cu-based materials in electrocatalysis.
The rearrangement of Cu surfaces under electrochemical conditions is known to play a key role in the surface activation for major electrocatalytic reactions. Despite the extensive experimental insights into such rearrangements, from surface-sensitive spectroscopy and microscopy, the spatial and temporal resolution of these methods is insufficient to provide an atomistic picture of the electrochemical interface. Theoretical characterization has also been challenged by the diversity of restructuring configurations, surface stoichiometry, adsorbate configurations, and the effect of the electrode potential. Here, atomistic insight into the restructuring of the electrochemical interface is gained from first principles. Cu(100) restructuring under varying applied potentials and adsorbate coverages is studied by grand canonical density functional theory and global optimization techniques, as well as ab initio molecular dynamics and mechanistic calculations. We show that electroreduction conditions cause the formation of a shifted-row reconstruction on Cu(100), induced by hydrogen adsorption. The reconstruction is initiated at 1/6 ML H coverage, when the Cu-H bonding sufficiently weakens the Cu-Cu bonds between the top- and sublayer, and further stabilized at 1/3 ML when H adsorbates fill all the created 3-fold hollow sites. The simulated scanning tunneling microscopy (STM) images of the calculated reconstructed interfaces agree with experimental in situ STM. However, compared to the thermodynamic prediction, the onsets of reconstruction events in the experiment occur at more negative applied voltages. This is attributed to kinetic effects in restructuring, which we describe via different statistical models, to produce the potential- and pH-dependent surface stability diagram. This manuscript provides rich atomistic insight into surface restructuring in electroreduction conditions, which is required for the understanding and design of Cu-based materials for electrocatalytic processes. It also offers the methodology to study the problem of in situ electrode reconstruction.

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