4.6 Article

Effects of tin particles addition on structural and mechanical properties of eutectic Sn-58Bi solder joint

Journal

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 33, Issue 28, Pages 22499-22507

Publisher

SPRINGER
DOI: 10.1007/s10854-022-09028-5

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Funding

  1. University of London, United Kingdom
  2. University of Malaya, Kuala Lumpur, Malaysia

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Due to the toxic properties of lead, the use of lead-free solder materials has become a necessary trend in the electronic packaging industry. This study focuses on the suppression of brittleness in Sn-58Bi alloy by adding different percentages of Sn powder. The results show that the dissolution of Sn particles significantly improves the mechanical strength and strain value of the Sn-58Bi alloy.
Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

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