Journal
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 70, Issue 9, Pages 4120-4128Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2022.3194204
Keywords
Integration; inverted microstrip gap waveguide (IMGW); millimeter wave (mmWave); monolithic microwave integrated circuit (MMIC); packaging; ridge gap waveguide (RGW); transition
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Funding
- Swedish Strategic Vehicle Research and Innovation (FFI) [2018-02707]
- Vinnova [2018-02707] Funding Source: Vinnova
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This article discusses three integration and packaging techniques for gap waveguides and monolithic microwave integrated circuits (MMICs) suitable for multilayer waveguide applications. It presents two vertical transitions between microstrips and ridge gap waveguides (RGWs), as well as the integration of MMIC with inverted microstrip gap waveguide (IMGW) using a compact packaging structure. The results show consistent operational characteristics and performance with passive measurements.
This article discusses three integration and packaging techniques for gap waveguides and monolithic microwave integrated circuits (MMICs) suitable for multilayer waveguide applications. Two vertical transitions between microstrips and ridge gap waveguides (RGWs) are presented. The first vertical transition connects RGW to a microstrip line from the top where a rectangular patch has been used. Measured results of the transition in a back-to-back structure show that the reflection coefficient is better than -10 dB from 75 to 83 GHz, and the insertion lass for a single transition over the frequency band is 0.65-0.85 dB. The second vertical transition connects RGW to a microstrip line from the back by a slot in the ground plane. Measured results of the transition in a back-to-back structure show that the reflection coefficient is better than -10 dB from 69 to 86 GHz, and the insertion loss for a single transition is 0.65-1 dB over the frequency hand. Commercially available E-band MMIC amplifiers are integrated with RGWs using the two proposed transitions. Moreover, for the very first time, the integration of MMIC with inverted microstrip gap waveguide (IMGW) is realized by a compact packaging structure that utilizes bond wires and capacitive pads. All the three active integrations are consistent with the passive measurements in terms of operational bandwidth, losses, amplifier gain flatness, and unwanted resonance suppression.
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