Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 69, Issue 10, Pages 5530-5535Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2022.3201837
Keywords
200 mm; breakdown voltage (BV); gallium nitride (GaN)/Si; high electron mobility transistor (HEMT); ohmic contact; radio frequency (RF); short channel effects (SCEs); silicon implantation
Funding
- Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking (JU) [783274]
- French Armed Forces Ministry through the Agence Innovation Defense
- European Union
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This study introduces a new contact technology for high-frequency transistors in the Ka-band, showing advantages such as low contact resistance and high breakdown voltage, and explores a new breakdown mechanism. Experimental results demonstrate that silicon implantation has a certain influence on improving breakdown voltage.
We present an access technology suitable for scaled gallium nitride (GaN) high electron mobility transistor (HEMT) in Ka-band. The comparison between oFF-state characteristics of a silicon implant-assisted contact and a conventional recessed Ti/Al-based Ohmic contact is presented. The transistor with source/drain extension by Si implantation has a low contact resistance with R-C down to 0.4 Omega. mm and a sheet resistance of the implanted layer of 67 Omega/sq. In addition to promising contact performance, transistors with source and drain extension sustain high breakdown voltage (BV) with short dimensions for high-frequency applications. The systematic study of gate-source, gate-drain, and gate length variations shows a new breakdown mechanism for implanted access technology with current flowing beneath the channel leading to an unusual correlation between source-drain spacing and By. With a conventional titanium-alloyed contact, a punchthrough effect is responsible for the By. Cross-sectional transmission electron microscopy and secondary ion mass spectroscopy (SIMS) characterizations on both wafers highlight a degradation of the AlGaN-based back-barrier and a high silicon concentration deep into the epitaxial stack on the implanted wafers indicating a way to improve BV with an adapted process flow.
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