4.4 Article

Assessment of Broadband Shielding Effectiveness of Composite Panels for Protective Enclosures

Journal

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
Volume 64, Issue 5, Pages 1750-1757

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEMC.2022.3199904

Keywords

Steel; Numerical models; Magnetic shielding; Magnetic noise; Graphene; Three-dimensional displays; Permeability; Composite; enclosure; far-field; near-field; shiel-ding effectiveness

Funding

  1. LabEx LaSIPS [ANR-10-LABX-0032-LaSIPS]
  2. French National Research Agency [ANR-11-IDEX-0003]
  3. Agence Nationale de la Recherche (ANR) [ANR-11-IDEX-0003] Funding Source: Agence Nationale de la Recherche (ANR)

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The article investigates the shielding effectiveness of a metallic enclosure with a multilayer composite cover over a wide frequency range. The use of the composite cover provides similar shielding effectiveness in the far-field and higher specific shielding effectiveness in the near-field.
The article investigates the shielding effectiveness (SE) of a metallic enclosure with a multilayer composite cover over a wide frequency range, from near-field magnetic shielding (1 Hz-1 MHz) to far-field electromagnetic shielding (4-14 GHz). Two enclosures are considered: a conductive enclosure made of aluminum and a magnetic enclosure made of steel. The multilayer composite is a trilayer combining a thin conductive layer of graphene and a thin magnetic layer of a Fe-Ni alloy on either side of a fiberglass plate. To determine the SE of these enclosures in both low-frequency and high-frequency approaches, two experimental setups and two numerical models are developed. The use of the composite cover, instead of the metallic one, gives a similar level of SE in the far-field and a higher specific SE (i.e., SE divided by the material density) in the near-field from 1 Hz to 2 kHz. Such quantitative analysis is the first step to designing practical enclosures entirely covered with composite panels to face electromagnetic compatibility (EMC) constraints in embedded systems.

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